1. Rapid furnace heat-up/cool-down 2. Mini-batch processing 3. Transfer system 4. Controller |
|
Fours verticaux pour 300mm wafer
JTEKT Thermo Systems est représentée en Europe par
|
The VF-5700 is a mini-batch system that employs a heating element that both raises temperatures rapidly and cools down quickly, enabling Q-TAT. The VF-5700 is ideal for use in research and development programs because it can process small runs and can handle different components at the same time.
The key points about the VF-5700 are its
ability to handle small batches and its very short heat-up and
cool-down times. The system is extremely flexible, and can handle both
R&D and mass-production applications. The turntable-type cassette
stocker can handle 4 stocks and 2 process cassettes.
A highly reliable twin-arm scalar robot transfers the wafers. The boat
has been specially designed to prevent slip line propagation, enabling
this rapid-heating/cooling system to easily handle 300-mm wafers.The
heater is a newly designed double-shell LGO element capable of
rapidly raising and lowering the furnace temperature and maintaining
stability.
Now also a FOUP version is available. In this version the wafers are transferred by robot directly from the cassette in the FOUP box to the quartz boat. This setup allows combination of small foot print, high performance and low price.
| Features | |||
|---|---|---|---|
|
| Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Model | VF-5700 | ||||||||
| Wafer size | 300mm | 8" | |||||||
| Outside dimension(mm) | W1100 x D2250 x H2900 | W900 x D1850 x H2450 | |||||||
| Batch size | 26/50 | 50 | |||||||
| Continous treatment | 2batch | ||||||||
| Heater | Double Shell LGO heater | ||||||||
| Service temperature | 300 - 1050deg.-c | ||||||||
| Flat zone(mm) | 500 | ||||||||
| Temperature control | 3zone | ||||||||
| Cassette stock | 4 | ||||||||
| Process cassette | 2 | ||||||||
| Dummy cassette | 1 | ||||||||
| Monitor cassette | 1 | ||||||||
| Wafer transfer | vacuumless | ||||||||
| Finger | 5/1 | ||||||||
| Controller | Model 1200 | ||||||||
| Applicable to SECS | possible | ||||||||
| Applicable to AGV | impossible | ||||||||
| Applicable to SMIF/FOUP | impossible | ||||||||
| A Summary of Process Performance | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Pyro.Ox Thick film |
Pyro.Ox Thin film |
P-D-Poly | Poly-Si | HTO | Si3N4 | TEOS | |||
| Reaction gas | O2.H2 | O2.H2 | SiH4.PH3.H2 | SiH4 | SiH2Cl2.N2O | SiH2Cl2.NH3 | Si(C2H5O)4.O2 | ||
| Growth temp.(deg.-c) | 1000 - 1250 | 800 - 1000 | 550 - 600 | 600 - 620 | 870 - 890 | 770 - 800 | - 750 | ||
| Growth rate(A/min) | - | - | 12 - 20 | 60 - 100 | 40 - 50 | 20 - 50 | - 100 | ||
| Number of wafer(sheet) | 150 | 150 | 25 | 100 | 100 | 100 | 100/50 | ||
| Thickness variation(%) |
Inside wafer | 2 | 2 | 3 | 2 | 3 | 3 | 4 | 3 |
| Between wafers | 2 | 2 | 2 | 2 | 3 | 2 | 3 | 2 | |
| Between batches | 2 | 2 | 2 | 1 | 2 | 2 | 2 | 2 | |
Crystec Technology Trading GmbH, Germany, www.crystec.com, +49 8671 882173, FAX 882177
The VF-5900 furnace is a continuation of the VF-5300 model and has been developed to welcome the new age of 300-mm silicon wafers. The VF-5900 has a batch-processing system for the mass-handling of 300-mm wafers.
The VF-5900, designed to process 300-mm wafers, can accept a stack of 12 FOUPs (Front Opening Unified Pods) and can continuously process 2 batches, each of 100 wafers. All the FOUPs loaded into the I/O port are conveyed to the buffer shelves. After that, only the FOUPs that are required are conveyed to the internal door opener. The wafers are transported in a vacuum-less environment by a highly reliable twin-arm this word means Z-theta movement robot.The Ladder-type boat designed to minimize slip is a standard feature. The VF-5900 furnace uses an LGO heating element, and has a forced-cooling system to increase the throughput. As an optional feature, the N2 load lock can be utilized to maximize the processing capacity.
| Features | |||
|---|---|---|---|
|
| Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Model | VF-5900 | ||||||||
| Wafer size | 300mm | ||||||||
| Outside dimension(mm) | W1200 x D2750 x H3350 | ||||||||
| Batch size | 100 | ||||||||
| Continuous treatment | 2 batch | ||||||||
| Heater | LGO heater | ||||||||
| Service temperature | 300 - 1050deg.-c | ||||||||
| Flat zone(mm) | 1060 | ||||||||
| Temperature control | 4zone | ||||||||
| Cassette stock | 12 | ||||||||
| Process cassette | 8 | ||||||||
| Dummy cassette | 2 | ||||||||
| Monitor cassette | 2 | ||||||||
| Wafer transfer | vacuumless | ||||||||
| Finger | 5+1 | ||||||||
| Controller | Model 1400 | ||||||||
| Applicable to SECS | possible | ||||||||
| Applicable to AGV | possible | ||||||||
| Applicable to SMIF/FOUP | possible | ||||||||
| A Summary of Process Performance | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Pyro.Ox Thick film |
Pyro.Ox Thin film |
P-D-Poly | Poly-Si | HTO | Si3N4 | TEOS | |||
| Reaction gas | O2.H2 | O2.H2 | SiH4.PH3.H2 | SiH4 | SiH2Cl2.N2O | SiH2Cl2.NH3 | Si(C2H5O)4.O2 | ||
| Growth temp.(deg.-c) | 1000 - 1250 | 800 - 1000 | 550 - 600 | 600 - 620 | 870 - 890 | 770 - 800 | - 750 | ||
| Growth rate(A/min) | - | - | 12 - 20 | 60 - 100 | 40 - 50 | 20 - 50 | - 100 | ||
| Number of wafer(sheet) | 150 | 150 | 25 | 100 | 100 | 100 | 100/50 | ||
| Thickness variation(%) |
Inside wafer | 2 | 2 | 3 | 2 | 3 | 3 | 4 | 3 |
| Between wafers | 2 | 2 | 2 | 2 | 3 | 2 | 3 | 2 | |
| Between batches | 2 | 2 | 2 | 1 | 2 | 2 | 2 | 2 | |
Crystec Technology Trading GmbH, Germany, www.crystec.com, +33/476/911002, FAX 911168
Tous les modèles de fours listés ci-dessus répondent aux normes CE et sont certifiés chez le constructeur par un organisme agréé.
Utilisez ce lien pour en savoir plus sur: Comparaison des Fours Verticaux et
Horizonteaux.!
JTEKT Thermo Systems et Crystec sont prêts à étudier pour vous, le système qui répondra à vos exigences en présentant le meilleur rapport qualité / prix.
