Vertical Furnaces for 300mm Wafer

JTEKT Thermo Systems is represented in Europe by
Crystec Technology Trading GmbH

VF-5700

Rapid Heat up/Cool down furnace


The VF-5700 is a mini-batch system that employs a heating element that both raises temperatures rapidly and cools down quickly, enabling Q-TAT. The VF-5700 is ideal for use in research and development programs because it can process small runs and can handle different components at the same time.


Summary

The key points about the VF-5700 are its ability to handle small batches and its very short heat-up and cool-down times. The system is extremely flexible, and can handle both R&D and mass-production applications. The turntable-type cassette stocker can handle 4 stocks and 2 process cassettes.
A highly reliable twin-arm scalar robot transfers the wafers. The boat has been specially designed to prevent slip line propagation, enabling this rapid-heating/cooling system to easily handle 300-mm wafers.The heater is a newly designed double-shell LGO element capable of rapidly raising and lowering the furnace temperature and maintaining stability.

Now also a FOUP version is available. In this version the wafers are transferred by robot directly from the cassette in the FOUP box to the quartz boat. This setup allows combination of small foot print, high performance and low price.


Features

1. Rapid furnace heat-up/cool-down
Rapid furnace heat-up/cool-down
The double-shell LGO heating element enables a maximum heating rate of 60°C/min and a maximum cooling rate of 50°C/min. The ability to load the furnace at low temperatures means that the throughput is not reduced due to the short heat-up times.

2. Mini-batch processing
Ideal for small-lot production and R&D applications.

3. Transfer system
The simple structure means ease of maintenance.

4. Controller
Windows is used to enhance control


VF-5700

Specification
Model VF-5700
Wafer size 300mm 8"
Outside dimension(mm) W1100 x D2250 x H2900 W900 x D1850 x H2450
Batch size 26/50 50
Continous treatment 2batch
Heater Double Shell LGO heater
Service temperature 300 - 1050deg.-c
Flat zone(mm) 500
Temperature control 3zone
Cassette stock 4
Process cassette 2
Dummy cassette 1
Monitor cassette 1
Wafer transfer vacuumless
Finger 5/1
Controller Model 1200
Applicable to SECS possible
Applicable to AGV impossible
Applicable to SMIF/FOUP impossible

A Summary of Process Performance
Pyro.Ox Thick
film
Pyro.Ox Thin
film
P-D-Poly Poly-Si HTO Si3N4 TEOS
Reaction gas O2.H2 O2.H2 SiH4.PH3.H2 SiH4 SiH2Cl2.N2O SiH2Cl2.NH3 Si(C2H5O)4.O2
Growth temp.(deg.-c) 1000 - 1250 800 - 1000 550 - 600 600 - 620 870 - 890 770 - 800 - 750
Growth rate(A/min) - - 12 - 20 60 - 100 40 - 50 20 - 50 - 100
Number of wafer(sheet) 150 150 25 100 100 100 100/50
Thickness
variation(%)
Inside wafer 2 2 3 2 3 3 4 3
Between wafers 2 2 2 2 3 2 3 2
Between batches 2 2 2 1 2 2 2 2


Crystec Technology Trading GmbH, Germany, www.crystec.com, +49 8671 882173, FAX 882177
Linie

VF-5900


The VF-5900 furnace is a continuation of the VF-5300 model and has been developed to welcome the new age of 300-mm silicon wafers. The VF-5900 has a batch-processing system for the mass-handling of 300-mm wafers.


Summary

The VF-5900, designed to process 300-mm wafers, can accept a stack of 12 FOUPs (Front Opening Unified Pods) and can continuously process 2 batches, each of 100 wafers. All the FOUPs loaded into the I/O port are conveyed to the buffer shelves. After that, only the FOUPs that are required are conveyed to the internal door opener. The wafers are transported in a vacuum-less environment by a highly reliable twin-arm this word means Z-theta movement robot.The Ladder-type boat designed to minimize slip is a standard feature. The VF-5900 furnace uses an LGO heating element, and has a forced-cooling system to increase the throughput. As an optional feature, the N2 load lock can be utilized to maximize the processing capacity.


Features

1. High processing capacity
Up to 100 wafers can be continuously processed in 2 batches.

2. Newly developed heating elements
The furnace has heaters for low-temperature/low-temperature processes.

3. N2 load lock
The capacity of the VF-5900's N2 load lock chamber has been redesigned to enhance the throughput.

4. Ease of use
Control is simplified by use of the Model 1400 controller which incorporates industry data requirements. (HSMS and GEM compatible.)

5. Maintenance
The removable FOUP buffer allows easier maintenance.

6. Footprint
Only the main unit of the VF-5900 is set up in the clean room; the supporting systems can all be installed under the floor to reduce the overall footprint significantly.


VF-5900

Specification
Model VF-5900
Wafer size 300mm
Outside dimension(mm) W1200 x D2750 x H3350
Batch size 100
Continuous treatment 2 batch
Heater LGO heater
Service temperature 300 - 1050deg.-c
Flat zone(mm) 1060
Temperature control 4zone
Cassette stock 12
Process cassette 8
Dummy cassette 2
Monitor cassette 2
Wafer transfer vacuumless
Finger 5+1
Controller Model 1400
Applicable to SECS possible
Applicable to AGV possible
Applicable to SMIF/FOUP possible

A Summary of Process Performance
Pyro.Ox Thick
film
Pyro.Ox Thin
film
P-D-Poly Poly-Si HTO Si3N4 TEOS
Reaction gas O2.H2 O2.H2 SiH4.PH3.H2 SiH4 SiH2Cl2.N2O SiH2Cl2.NH3 Si(C2H5O)4.O2
Growth temp.(deg.-c) 1000 - 1250 800 - 1000 550 - 600 600 - 620 870 - 890 770 - 800 - 750
Growth rate(A/min) - - 12 - 20 60 - 100 40 - 50 20 - 50 - 100
Number of wafer(sheet) 150 150 25 100 100 100 100/50
Thickness
variation(%)
Inside wafer 2 2 3 2 3 3 4 3
Between wafers 2 2 2 2 3 2 3 2
Between batches 2 2 2 1 2 2 2 2

Crystec Technology Trading GmbH, Germany, www.crystec.com, +49 8671 882173, FAX 882177
line

All JTEKT Thermo Systems (previously Koyo Thermo Systems) furnaces are CE certified.

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JTEKT Thermo Systems and Crystec will be pleased to engineer a cost effective system to satisfy your most demanding and exacting requirements.