Crystec Technology Trading GmbH

The CLH ovens enable precise and clean processing up to 530 °C thanks to a heat-resistant high-performance filter and a specially developed cooling system. As a result, the process chamber remains at cleanroom level (Class 100) even at high temperatures.

With two powerful circulation systems, side airflow or horizontal front airflow, the units provide excellent temperature uniformity and high energy efficiency. By allowing the introduction of nitrogen (N₂), they are ideal for applications that require ultra-low oxygen concentrations (≤ 20 ppm).

Ideal for semiconductor wafers, glass substrates and all thermal processes that demand the highest accuracy, cleanliness and stability. A special version for curing non-photo-sensitive polyimide is available.

The convection-heated oven model INH can be used for many applications that require heating in an oxygen-free atmosphere. It can be operated with protective or inert gases such as nitrogen (N₂) and argon (Ar), but can also be run in air. The oven is suitable, for example, for thermal treatment of LCD glass, tempering of metals, surface hardening, drying, and annealing and curing of various materials. The gas is heated in an external heater. The heated gas is then guided through the oven chamber in a laminar gas flow. Gas enters through a perforated oven chamber wall. The size of the inlet holes can be adjusted to achieve very good temperature uniformity within the oven. The gas leaves the chamber through the opposite, also perforated wall and is circulated back to the heater. A small amount of fresh gas is continuously added to the main gas flow and the same amount exits again through the exhaust. The oven chamber is made of stainless steel and can accommodate multiple shelf trays.

The fully automatic cleanroom oven model S02 was developed to meet the requirements of modern high-volume semiconductor production and offers the highest precision and efficiency for thermal processes. It is suitable for advanced packaging technologies such as chiplets, 2.xD and 3D and handles both round wafers with a diameter of Φ300 mm and square substrates up to 600 × 600 mm.

The integrated automatic substrate transfer mechanism enables fast and reliable material flow. A single robot services two process chambers, each of which can be equipped with two FOUPs. The dual wafer handling provides particularly fast transfer and supports the demands of high-volume manufacturing. The oven is fully designed for cleanroom operation and provides a stable environment for sensitive processes.

In addition to high-temperature applications, low-temperature processing is also possible, particularly for the curing of polyimide layers. Typical applications include thermal treatment of substrates in advanced packaging processes, polyimide curing for FO‑WLP and WL‑CSP, and bake processes for stabilizing materials and layers. The system is also suitable for degreasing and pretreatment of glass, ceramic and LTCC substrates.

With its combination of automation, cleanroom suitability and flexible substrate compatibility, this oven offers a powerful solution for the next generation of semiconductor manufacturing.